![Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30, Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30,](http://www.chycec.com/content/dam/toshiba-ss-sales/shared/image/business-unit-info/discrete/png/1035_3_e_re.png)
Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30,
![Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30, Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30,](http://www.chycec.com/content/dam/toshiba-ss-sales/shared/image/business-unit-info/discrete/png/1035_2_e.png)
Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30,
![CUH-41-30010, 373 pcs TE Connectivity Potter & Brumfield Relays CUH-41-30010 stock available at distributor - component-rs.com CUH-41-30010, 373 pcs TE Connectivity Potter & Brumfield Relays CUH-41-30010 stock available at distributor - component-rs.com](https://image.component-en.com/hd/CUH-41-30010-305063.jpg)
CUH-41-30010, 373 pcs TE Connectivity Potter & Brumfield Relays CUH-41-30010 stock available at distributor - component-rs.com
![Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30, Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30,](https://toshiba.semicon-storage.com/content/dam/toshiba-ss-sales/shared/image/business-unit-info/discrete/jpg/1035_1.jpg)
Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30,
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